3-1437535-4

Manufacturer :

TE Connectivity AMP Connectors

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

10.0µin (0.25µm)

Contact Finish Thickness - Post :

10.0µin (0.25µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

Closed Frame

Housing Material :

-

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

20 (1 x 20)

Operating Temperature :

-

Packaging :

Bulk

Part Status :

Active

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

500

Termination :

Solder

Type :

SIP