24-6556-40

Manufacturer :

Aries Electronics

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

30.0µin (0.76µm)

Contact Finish Thickness - Post :

200.0µin (5.08µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Open Frame

Housing Material :

Polyphenylene Sulfide (PPS), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

24 (2 x 12)

Operating Temperature :

-

Packaging :

Bulk

Part Status :

Active

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

6556

Termination :

Solder Cup

Type :

DIP, 0.6" (15.24mm) Row Spacing