SIP1X16-014BLF

Manufacturer :

Amphenol FCI

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Tin

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

150.0µin (3.81µm)

Contact Finish Thickness - Post :

200.0µin (5.08µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Closed Frame

Housing Material :

Polyphenylene Sulfide (PPS), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

16 (1 x 16)

Operating Temperature :

-

Packaging :

Bulk

Part Status :

Obsolete

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

SIP1x

Termination :

Solder

Type :

SIP